Basic Info.
Printing
Machine Printing
Color
Silver
Application
Electronic Products, Promotion
Feature
Shock Resistance, Recyclable, Moisture Proof
Material
Laminated Material
Shape
Seal Bag
Making Process
Composite Packaging Bag
Raw Materials
High Pressure Polyethylene Plastic Bag
Bag Variety
Back Seal Bags
Transport Package
as Required
Specification
ROHS report
Trademark
DIASAP
Origin
China Suzhou
HS Code
3923210000
Production Capacity
100million Ton/ Year
Product Description
ESD Moisture Barrier Bag for Silicon Wafer with SGS
This aluminum foil bag is usually composed of four layers, and can protect inside products from static, electromagnetic interference, and moisture.
This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.
This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.
This laminated bag can print all symbols and can be customized according to customers' request.
ts the environment requirement of EU and North America in package.
This aluminum foil moisture proof bags are mainly applied to pack electronic components
(PCB, IC, HD driver)precise equipment and chemical raw material etc.
This customized plastic bag is featured by moisture barrier, anti-tearing, light isolation, and vacuum, esp. in long-distance sea shipment.
This laminated bag can print all symbols and can be customized according to customers' request.
ts the environment requirement of EU and North America in package.
| Product Description | |
| Product Name | ESD Moisture Barrier Bag for Silicon Wafer |
| Material Structure | Layers Laminated Material: PET/AL/NY/PE BOPP/AL/PE |
| Feature | Anti-static, moisture barrier,light isolation |
| Printing | Customized |
| Surface Resistance | 10^8~10^11 Ohm |
| Thickness | Customized(0.06--0.2mm available) |
| Bag Style | Open top/ zip lock/ envelope/ gusset/ three dimensional |
| Package | 50~100pcs per bag and then in cartons or as per customer's request |
| Usage | Electronic components (PCB, IC, HD driver),precise equipment and chemical raw material etc. |
Technical Parameters:
| NO. | Item | Standard | Result |
| 1 | Puncture Strength | MIL-STD-3010B | ≥24LBF |
| 2 | Surface resistivity | ASTM D-257 | 10^6-10^11ohm |
| 3 | Decay time | IEC61340-5-1 | <0.3s |
| 4 | WVTR | ASTM F1249 | ≤0.0006g/100in²/24hs |
| 5 | OTR | ASTM D3985 | ≤0.01cc/100in²/24hs |
| 6 | Heat-Seal Temperature | 160%±10% | |
| 7 | Heat-Seal Pressure | 70Pa | |
| 8 | Heat-Seal Time | ≤1.5S |
Product Pictures:
Factory Show:
Factory Show:
Other related products:
1. Moisture barrier Bags/Aluminum Foil Bag
2. ESD Bubble Cushioned Bag
3. Nylon Bag/Vacuum Bag
4. Air Bubble Bag/making machine
5. Industrial Cotton Swab Series
6. Humidity Indicator Card
7. Cleanroom Consumable Series
Free samples will be sent for your evaluation!
1. Moisture barrier Bags/Aluminum Foil Bag
2. ESD Bubble Cushioned Bag
3. Nylon Bag/Vacuum Bag
4. Air Bubble Bag/making machine
5. Industrial Cotton Swab Series
6. Humidity Indicator Card
7. Cleanroom Consumable Series
Free samples will be sent for your evaluation!